Laser MicroMachining

Laser removal of semiconductor links to correct errant design or re-direct conductive paths.

Solder mask removal

Electroplating link/shorting bar removal

Silicon, ceramic, plastic, SS / Al <0.005" thick

Al2O3 Ceramic <0.010"

Polyimide / Kapton

1st harmonic (1064nm) and 3rd harmonic (355nm) pulsed YAG laser systems

Spot size range = 3um - 50um (0.00015” - 0.002"),

Hole diameters <0.001” possible, material composition / thickness dependent

Read more about Laser Wafer Trimming